Increased precision: Robert Bosch GmbH chooses new OMRON inline 3D CT X-ray inspection system VT-X750
Printed circuit boards (PCBs) are central component of numerous electrical devices, and the automotive industry is also increasingly dependent on PCBs that do not have any weak points. To ensure top inspection quality, the internationally active Robert Bosch GmbH uses OMRON technology. The third generation of the VT-X750 3D X-ray inspection system is based on ultra-high-speed computed tomography (CT) to guarantee precise and reliable inspection of hidden soldering areas during production. Solder defects such as "head in pillow" or void in BGA, LGA, THT, and other discrete components can be detected much better than with other tomographic methods. The image quality of the CT process, for example, is significantly higher than Laminography or tomosynthesis.
High speed and better resolution
Automotive applications demand increasingly higher quality standards to comply with autonomous drive system control levels 4 and 5 by 2025. As a result, the development of components has become more sophisticated and powerful, where PCBs become smaller in this context, while their assembly density is increasing. One hundred percent reliable PCBs are essential because of high quality and safety requirements. Due to the immense complexity of automotive components, the need for automatic and high-quality testing has increased where International automotive groups impose strict requirements on the quality of inspection technology. With the VT-X750 3D-AXI AVL devices used by Bosch, the inspection can be performed without stopping the assembly. This ensures high speed with better resolution. The CT process provides true 3D data that operators and programmers can also use.
AI cuts programming time
Fault-free processes are the focus of the VT-X750 units, the latest 3D CT AXI technology on the market. While traditional X-ray solutions are limited to the inspection of components such as BGAs, LGAs, or THT, the VT-X750 uses high-speed computed tomography (CT). Technical improvements have enabled enhanced improvements in cycle times by up to 1.5 times faster compared to our previous VT-X750 model’s, enabling new VT-X750 to be the first viable in-line CT AXI solution. Added to this are innovative AI functions that reduce programming time and take a lot of effort out of the operator's programming where BGA’s are created in less than 60 seconds including automatic extraction for accurate measurement. VT-X750 software adjusts the contrast image by automatically correcting the X-ray tube voltage as well as current exposure time, and CT value. Self-propelled systems can be connected.
The VT-X750 supports Bosch and other users with advanced inspection for PCBA design without design limitations. Added to this are full 3D CT data processing and implementation of IoT projects for manufacturing. It thus makes a valuable contribution to streamlining PCB inspection, strengthening quality in the automotive sector, relieving employees, and improving safety in general.
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