VT-X950

3D-AXI Automated X-ray Inspection

The X950 is the first in the VT series to support clean rooms for mid-process semiconductors where wafer-to-wafer bonding processes occur. It is also equipped with a function that automatically changes inspection settings to accommodate sudden changes in production items due to fluctuating demand. The system automatically changes conditions by referencing measurement points and inspection settings registered in advance in the production control system that are appropriate for each production item. This reduces start-up losses and re-setting of inspection settings.

• Ultra-microfocus X-ray source 
• Equipped with a conveyor-based automatic loading/unloading function, contributing to automation and manpower saving in the manufacturing process
• Supports clean room and automatic setting change
• Technology to capture stereoscopic images without stopping
• Bump electrodes formed with a narrow pitch to bond IC devices together
• The system uses AI technology to determine whether a product is good or defective by processing captured images using deep learning
• Resolution down to 0.2 μm/Pix