VP9000

3D-SPI Automated Solder Paste Inspection

The VP9000, is High Performance cutting-edge solution designed to minimize waste in PCB production while advancing towards smaller and higher density components. This state-of-the- art system enhances inspection efficiency through innovative 3D image processing and industry- leading high-speed inspection capabilities. The VP9000's distinctive Smart SMT Style not only analyses but also optimizes printing conditions, offering the highest performance to effectively prevent printing defects for a seamless production process.

• High-Speed 100% 3D Solder Paste Inspection including 12MP camera
• Highly Accurate Solder Paste Volume Measurement (within 2%)
• Multiple Resolution Setting with 3-Mode Zoom Function (down to 5µm)
• User-Friendly Software with Integrated, Graphical Use Interface
• Simple Program Creation from GERBER and or Mount Data (compatible with ePM)
• Complete Offline Program Generation without Interrupting Production.
• Active Warp compensation
• Closed-loop with printer and feed-forward with Placement systems
• Dual lane SPI available soon end of 2024
• Glue and Foreign Material Inspection.
• Unique Connection to: Omron Q-upNavi: Combine Omron SPI, AOI and AXI Result Data Together for True Root-Cause Analysis.
• Unique Connection to: Omron Q-upOpti: Skill-less SPI Setting and Optimisation calculated from AOI Solder Values.  
• Unique Connection to: Omron Q-upAuto-I: Production Quality Analysis across your Entire Production Line.