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- High-Speed 100% 3D Solder Paste Inspection
- Highly Accurate Solder Paste Volume Measurement (within 2%)
- Multiple Resolution Options and 3-Mode Zoom (down to 5µm)
- Two Available Machine Sizes to Handle PCBs Ranging from 250mm x 330mm to 460mm x 510mm
- User-Friendly Software and Integrated, Touch-Screen Interface
- Simple Program Creation from GERBER and/or Mount Data (compatible with ePM)
- Full Offline Program Generation
- Real-Time Process Monitoring
- Data Analysis and Quality Control Software Tools (compatible with Omron Q-Up Navi software)
- Glue and Foreign Material Inspection.
Full 3D Data Processing and realization of Industrial 4.0 Smart Factory Solution.
Omron Q-upNavi: Combine SPI, AOI and AXI Result Data Together for True Root-Cause Analysis.
Omron Q-upAuto: Total Quality Control Across the Entire Production Line.
VP9000 is the latest 3D-SPI technology on the market, suitable for tomorrows production environments.