Lead component Coplanarity / Lead bending
This is an example of a lifting failure of the lead component. The height information of the terminal makes it possible to judge the coplanarity of the component. This function can analyze if the lifting failure is caused by a coplanarity abnormality of the component.
If a lifting failure of the lead component occurs, it is necessary to check if the defect has existed since the time of delivery of the component or to check conditions of mounting process. It is also necessary to control printing solder volume to be supplied to absorb the coplanarity.