SMT Hybrid Packaging

We are pleased to announce Omron's presence at SMT Hybrid Packaging. It runs from the 5th to the 7th of June at the Exhibition Centre Nuremberg in Germany. You can find us in Hall 4A,  Booth 300.

Omron will exhibit its latest technology on 3D AOI and 3D AXI as well as combined solutions with Omron robotics products.  Omron will also exhibit all machines on the FUTURE PACKAGING booth of the Fraunhofer Institute with its German partner ATEcare.

Go to the following page for more information: www.mesago.de