New VT-S730: The latest advanced technology in Post Reflow AOI system | Omron AOI, Europe

New VT-S730: The latest advanced technology in Post Reflow AOI system

You can now certify your SMT production with full IPC standard compliance using our new 3D-SJI technology. We are proud to announce the launch of the latest advanced technology in Post Reflow AOI system to complete the existing "VT-S Series": The VT-S730.

Nowadays, production needs are evolving with the consolidation of the traceability, the implementation of quality management on a global basis and the best possible Product inspection capability. As a necessity to further requests in quality management and inspection capability, we released the VT-S730.

In addition to the color highlight ™ 3D solder shape reconstruction technology, this new machine is now equipped with a specific phase shift inspection technology that makes it a highly efficient inspection system.

One major argument here is that it is NOT just another Phase Shift Machine. It is much more than that and the inspection capability of this new machine is amongst the highest available on the market today.

With this new COMBO Technology called 3D-SJI , the VT-S730 can easily detect lifted lead, lifted component, component coplanarity, as well as giving a veryhigh quality in Solder joint inspection.

The VT-S730 is an advanced and a “best in class” 3D AOI system on the market and confirms Omron’s industrial leading position with over 7500 machines installed. We give you a system to allow you to fully comply with IPC/ISO-TS rules and qualify all your SMT process using a unique 3D technology.

We have been a technological leader in AOI for 30 years using real color image processing that even today, provides unsurpassed inspection capability. In addition the new advanced software platform allows very fast and simple programming.Real 3D AOI technology gives extremely accurate images and measurements to defineclearly the Quality level you must achieve. Production verification has never been safer and doubt free thanks to 3D image and measurement values related to IPC.

To allow full performance of the S730 platform, We have developed an impressive Process Improvement Tool called Q-upNavi. The expert system Q-upNavi provides integrated software tools for the monitoring and improvement of each stage of the manufacturing process including solder paste  screen printing, placement, reflow, post solder inspection and X-ray. This module allows complete analysis of the flow of information relevant to the real faults immediately and continuously identifying the real source and therefore enabling targeted intervention. QupNavi also displays 3D images of the defects found by VT-S730, therefore the operator can more easily study and qualify the defects.

With the VT-S730, we target High Quality SMT productions through its high performance and high speed inspection

Using the VP6000-V (3D Solder Paste Inspection), VT-S500 (3D Pre & Post Reflow Solder joint Inspection), VT-S720 (3D Solder Joint inspection), VT-S730 (Full 3D Solder and component inspection) and VT-X700 (Post reflow, X-Ray Inspection True 3D CT), we offer a complete range of high quality 3D inspection machines for each stage of the manufacturing process.