With VP series full 3D paste inspection of all pads is reality: it is designed to offer high-speed, high precision 3D inspection inline with maximum throughput. The 3CCD camera is placed vertically to the solder, and the projector radiates a colored stripe light pattern and an anlge above the object. The amount of the deviation of the projected stripe pattern from the object is converted into the height, according to the triangulation principle. Because the solder printed on the substrate is measured in the plane, the inspection speed it fast. The color stripe phase shifting is adopted to create 3D images by projecting RGB patterned light.

• High speed 100% analysis of solder paste
• Accurate 3D volume inspection technology
• Simple conversion of Gerber data for easy programming
• Off-line programming and data analysis
• 2D code reading (option)

Measurement Principle of VP Series: The CCD camera is placed vertically to the solder and the projector radiates a colored stripe light pattern at an angle above the object. The amount of the deviation of the projected stripe pattern from the object, is converted into the height according to the triangulation principle. Because the solder printed on the substrate is measured in the same plane, the inspection speed is fast. The color stripe phase shifting is adopted to create 3D images by projecting RGB patterned light.